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The imaging performance of a mask in EUV lithography is governed by the optical properties of the absorber material, namely the refractive index n and extinction coefficient k, and by its thickness. The imaging metrics viz. Normalized Intensity Log Slope (NILS), Telecentricity Error (TCE) and Best Focus Variation (BFV) through pitch, exhibit a tradeoff. In addition, the choice of illumination has a significant influence on these imaging metrics. Most of the previous studies have focused on either reflectivity or phase shift induced by the absorber to determine the optimum absorber thickness. The limitation of this approach is that the structure of the patterns on the mask is ignored. This simulation study is intended to facilitate the selection of the optimum absorber thickness with an emphasis on diffraction order analysis and the impact of illumination source shape using a case study of TaCo alloy. The behavior of imaging metrics is investigated as a function of absorber thickness in combination with illumination source shapes recommended in the literature. Maximal NILS, TCE within specified limits, balancing of diffraction order amplitudes with a minimum phase difference, and throughput criterion, are the important parameters that are considered when selecting the optimum absorber thickness. We evaluate and compare the through pitch imaging performance of TaCo alloy with recommended thicknesses, to that of the reference TaBN 60 nm absorber using Leaf shape Dipole (LDP), Inner Half Leaf shape Dipole (IHLDP) and Outer Half Leaf shape Dipole (OHLDP) for Line and Space (LnS) pattern with trench width of 10nm and the smallest pitch of 20 nm. The study confirms that TaCo alloy exhibits improved NILS and lower BFV compared to the reference TaBN 60 nm absorber.
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