Design of high-frequency test fixture considering impedance matching

Yi Peng; QiangMing Cai; Lanqing Yang; Xin Cao; Longjian Zhou; Haoran Li; Yuyu Zhu

doi:10.1117/12.3025450

28 February 2024 Design of high-frequency test fixture considering impedance matching

Yi Peng, QiangMing Cai, Lanqing Yang, Xin Cao, Longjian Zhou, Haoran Li, Yuyu Zhu

Proceedings Volume 13071, International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023); 1307115 (2024) https://doi.org/10.1117/12.3025450
Event: International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023), 2023, Shenyang, China

Abstract

This paper presents the design of a high-frequency test fixture for high-speed connectors. Specifically, after analyzing and designing the board material, laminate structure, trace structure, and signal via structure, the impedance consistency and bandwidth of the high-speed interconnect structure are verified through TDR and S-parameter simulations conducted in HFSS. a PCB layout is generated using Cadence. The test results confirm that the differential impedance of the fixture meets the requirements for high-speed connector testing. Within the frequency range of 0-30 GHz, the difference between S11 and S21 for the 2x-thru structure is greater than 0 dB, indicating a bandwidth capability of up to 30 GHz for the fixture.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Yi Peng, QiangMing Cai, Lanqing Yang, Xin Cao, Longjian Zhou, Haoran Li, and Yuyu Zhu "Design of high-frequency test fixture considering impedance matching", Proc. SPIE 13071, International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023), 1307115 (28 February 2024); https://doi.org/10.1117/12.3025450

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