Three-axis microactuator for smart optical interconnect system

Edward V. White; Mark D. Rogers; John M. Haake

doi:10.1117/12.320188

20 July 1998 Three-axis microactuator for smart optical interconnect system

Edward V. White, Mark D. Rogers, John M. Haake

Proceedings Volume 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS; (1998) https://doi.org/10.1117/12.320188
Event: 5th Annual International Symposium on Smart Structures and Materials, 1998, San Diego, CA, United States

Abstract

We propose the utilization of a Smart In-Package [Micro] ALigner (SIMPAL) to enable fiber optical sensors for thick walled composite structures. Fiber optic coupling is the barrier preventing single mode and multimode fiber optical sensors systems from being incorporated into composite structures. A fiber optic connector that has a MEMS in-package micro aligner, integrated optical detectors, and control electronics is proposed to overcome the incompatibility between structural manufacturing tolerances and fiber optic alignment tolerances. The SIMPAL technology will enable affordable optical connection with sub-micron alignment tolerances to be made after the fiber optics are machined off at the egress point during a standard trimming process. We have demonstrated and described the MEMS actuator part of the SIMPAL. This active part is a 3-axis active fiber optic micro-aligner small enough to fit into current electro-optical packages. The micro-aligner is fabricated on a silicon wafer with the high aspect MEMS/LIGA process technology. The electrically controllable actuators demonstrate the high force and displacements necessary for in-package alignment of a micro-optics. The integration of lenses, optical sensors and control electronics is proposed to realize a smart optical backplane interconnect system.

Citation Download Citation

Edward V. White, Mark D. Rogers, and John M. Haake "Three-axis microactuator for smart optical interconnect system", Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); https://doi.org/10.1117/12.320188

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