Thermal expansion behavior of proposed EUVL substrate materials

Ina Mitra; Mark J. Davis; Jochen Alkemper; Rolf Mueller; Heiko Kohlmann; Lutz Aschke; Ewald Moersen; Simone Ritter; Hrabanus Hack; Wolfgang Pannhorst

doi:10.1117/12.472322

1 July 2002 Thermal expansion behavior of proposed EUVL substrate materials

Ina Mitra, Mark J. Davis, Jochen Alkemper, Rolf Mueller, Heiko Kohlmann, Lutz Aschke, Ewald Moersen, Simone Ritter, Hrabanus Hack, Wolfgang Pannhorst

Author Affiliations +

Proceedings Volume 4688, Emerging Lithographic Technologies VI; (2002) https://doi.org/10.1117/12.472322
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States

Abstract

The enhanced demands for substrate materials for next- generation optics and masks have initiated detailed investigations on Zerodur as a proposed EUVL substrate material. The dependence of thermal expansion of Zerodur on process parameters is illustrated herein as well as its utility for EUV substrate material demands. As a result of specifically adjusted process parameters, the coefficient of thermal expansion (CTE) was tailored to be a minimum at 22.5 degrees C. Laboratory samples of Zerodur exhibit a CTE corresponding to the lowest expansion class of the SEMI standard P37. By further variation of process parameters, the position of zero crossing, e.g. at 30 degrees C, can be varied, revealing an attractive attribute feature of Zerodur. A series of CTE measurements with a small block of Zerodur provides information on CTE homogeneity on a cm- scale: No CTE variation was observed within the error of measurements for a block exhibiting +/- 2 * 10^-6 variation in refractive index. A new dilatometer type is in the course of development. First operational results are expected in Summer 2002 with an increased accuracy < ppb/K in the temperature range of 17 to 30 degrees C.

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Ina Mitra, Mark J. Davis, Jochen Alkemper, Rolf Mueller, Heiko Kohlmann, Lutz Aschke, Ewald Moersen, Simone Ritter, Hrabanus Hack, and Wolfgang Pannhorst "Thermal expansion behavior of proposed EUVL substrate materials", Proc. SPIE 4688, Emerging Lithographic Technologies VI, (1 July 2002); https://doi.org/10.1117/12.472322

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