Paper
30 July 2002 Contact hole photo process improvement by multiple exposures with matched illumination settings
Yeong-Song Yen, I-Hsiung Huang, Jiunn-Ren Huang, Kuei-Chun Hung, Chi-fa Ku, Ching-Hsu Chang, Cheng Yu Fang, Paul P.W. Yen
Author Affiliations +
Abstract
A multiple exposure with matching illumination settings has been applied to the advanced photo process. We combine some special illumination settings which are good for each specific duty ratio and produce a good through-pitch performance. For example, we can combine OAI for dense and conventional with low sigma for Iso to optimize through pitch performance. With this method we can fine tune all illumination parameters, including NA, sigma, exposure dose, focus and pupil type. For sub-wavelength photolithography, the proximity effect of single illumination setting causes limited DOF through pitch so a compromise between isolated and dense pattern performance must be taken. Traditional exposure method using a single illumination setting can not fulfill the optimal illumination setting for patterns at all pitches. With this invention using multi-illumination settings, we can combine multiple exposures with the advantage of different illumination settings to perform better process capability include DOF and proximity through all pitches. Experimental data shows that the single exposure DOF of isolated hole and dense hole are below 0.2um but DOF can be enlarged to 0.4um by multiple exposure. And we get smaller proximity effect at the same time.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yeong-Song Yen, I-Hsiung Huang, Jiunn-Ren Huang, Kuei-Chun Hung, Chi-fa Ku, Ching-Hsu Chang, Cheng Yu Fang, and Paul P.W. Yen "Contact hole photo process improvement by multiple exposures with matched illumination settings", Proc. SPIE 4691, Optical Microlithography XV, (30 July 2002); https://doi.org/10.1117/12.474540
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KEYWORDS
Photomasks

Optical lithography

Semiconducting wafers

Lithographic illumination

Lithography

Finite element methods

Image processing

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