An analysis of in-process pattern inspection benefit-to-cost relationship

Larry S. Zurbrick

doi:10.1117/12.557729

20 August 2004 An analysis of in-process pattern inspection benefit-to-cost relationship

Larry S. Zurbrick

Proceedings Volume 5446, Photomask and Next-Generation Lithography Mask Technology XI; (2004) https://doi.org/10.1117/12.557729
Event: Photomask and Next Generation Lithography Mask Technology XI, 2004, Yokohama, Japan

Abstract

A model has been developed using process yields and costs in order to judge the benefit of performing multiple inspections during the manufacture of reticles that employ multiple writing steps in their manufacture. The model presented is forward looking in terms of judging whether an additional inspection step will incur added cost to the manufacturing process. For this forward looking model, only subsequent process step costs and prior process step yield to the proposed inspection point is required.

Citation Download Citation

Larry S. Zurbrick "An analysis of in-process pattern inspection benefit-to-cost relationship", Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); https://doi.org/10.1117/12.557729

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