Laser processing system development of large area and high precision

Hyeongchan Park; Kwanghyun Ryu; Taesang Hwang

doi:10.1117/12.2003998

13 March 2013 Laser processing system development of large area and high precision

Hyeongchan Park, Kwanghyun Ryu, Taesang Hwang

Proceedings Volume 8607, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVIII; 86071J (2013) https://doi.org/10.1117/12.2003998
Event: SPIE LASE, 2013, San Francisco, California, United States

Abstract

As industry of PCB (Printed Circuit Board) and display growing, this industry requires an increasingly high-precision quality so current cutting process in industry is preferred laser machining than mechanical machining. Now, laser machining is used almost “step and repeat” method in large area, but this method has a problem such as cutting quality in the continuity of edge parts, cutting speed and low productivity. To solve these problems in large area, on-the-fly (stagescanner synchronized system) is gradually increasing. On-the-fly technology is able to process large area with high speed because of stage-scanner synchronized moving. We designed laser-based high precision system with on-the-fly. In this system, we used UV nano-second pulse laser, power controller and scanner with telecentric f-theta lens. The power controller is consisted of HWP(Half Wave Plate), thin film plate polarizer, photo diode, micro step motor and control board. Laser power is possible to monitor real-time and adjust precision power by using power controller. Using this machine, we tested cutting of large area coverlay and sheet type large area PCB by applying on-the-fly. As a result, our developed machine is possible to process large area without the problem of the continuity of edge parts and by high cutting speed than competitor about coverlay.

Citation Download Citation

Hyeongchan Park, Kwanghyun Ryu, and Taesang Hwang "Laser processing system development of large area and high precision", Proc. SPIE 8607, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVIII, 86071J (13 March 2013); https://doi.org/10.1117/12.2003998

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KEYWORDS

Laser cutting

Laser processing

Laser systems engineering

Laser development

3D scanning

Laser scanners

Pulsed laser operation

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