Combining low loss SiN photonics with integration of active components

Michael Geiselmann

doi:10.1117/12.3001336

12 March 2024 Combining low loss SiN photonics with integration of active components

Michael Geiselmann

Proceedings Volume PC12892, Optical Interconnects XXIV; PC128920B (2024) https://doi.org/10.1117/12.3001336
Event: SPIE OPTO, 2024, San Francisco, California, United States

Abstract

This talk reviews the advantages of low loss silicon nitride photonic integrated circuits. We will present the LIGENTEC offering for low loss SiN PICs for application such as quantum optics, optical computing and telecommunication. Progress on integration of active materials to the low loss platform, such as InP and LNOI are discussed. Integration of actives such as InP reduces the laser linewidth and enables narrow linewidth tunable lasers. The talk reviews the fabrication offering of fast R&D cycles in low volume PIC fabrication though multi-project wafer runs to high volume PIC fabrication in an automotive qualified CMOS line.

Conference Presentation

Citation Download Citation

Michael Geiselmann "Combining low loss SiN photonics with integration of active components", Proc. SPIE PC12892, Optical Interconnects XXIV, PC128920B (12 March 2024); https://doi.org/10.1117/12.3001336

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