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Jiashuo Wang
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Publications (1)
Proceedings Article | 28 April 2023 Paper
Probability model of bridging defects for random logic via in 3nm double patterning technology at 0.33 NA
Proceedings Volume 12495, 124950C (2023) https://doi.org/10.1117/12.2658126
KEYWORDS: Double patterning technology, Optical lithography, Extreme ultraviolet, Logic, Critical dimension metrology, Source mask optimization, Overlay metrology, Design and modelling
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