This paper presents a technology of hybrid integration vertical cavity surface emitting lasers (VCSELs) directly on silicon photonics chip. By controlling the reflow of the solder balls used for electrical and mechanical bonding, the VCSELs were bonded at 10 degree to achieve the optimum angle-of-incidence to the planar grating coupler through vision based flip-chip techniques. The 1 dB discrepancy between optical loss values of flip-chip passive assembly and active alignment confirmed that the general purpose of the flip-chip design concept is achieved. This hybrid approach of integrating a miniaturized light source on chip opens the possibly of highly compact sensor system, which enable future portable and wearable diagnostics devices.
Huihui Lu, Jun Su Lee, Yan Zhao, Paolo Cardile, Aidan Daly, Lee Carroll, and Peter O'Brien, "Hybrid integration of VCSELs onto a silicon photonic platform for biosensing application," Proc. SPIE 10072, Optical Diagnostics and Sensing XVII: Toward Point-of-Care Diagnostics, 100720K (Presented at SPIE BiOS: January 31, 2017; Published: 17 February 2017); https://doi.org/10.1117/12.2250859.
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