High power diode lasers have been widely used in many fields. To meet the requirements of high power and high reliability, passively cooled single bar CS-packaged diode lasers must be robust to withstand thermal fatigue and operate long lifetime. In this work, a novel complete indium-free double-side cooling technology has been applied to package passively cooled high power diode lasers. Thermal behavior of hard solder CS-package diode lasers with different packaging structures was simulated and analyzed. Based on these results, the device structure and packaging process of double-side cooled CS-packaged diode lasers were optimized. A series of CW 200W 940nm high power diode lasers were developed and fabricated using hard solder bonding technology. The performance of the CW 200W 940nm high power diode lasers, such as output power, spectrum, thermal resistance, near field, far field, smile, lifetime, etc., is characterized and analyzed.
Jingwei Wang, Pengfei Zhu, Hui Liu, Xuejie Liang, Dihai Wu, Yalong Liu, Dongshan Yu, Chung-en Zah, and Xingsheng Liu, "Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology," Proc. SPIE 10085, Components and Packaging for Laser Systems III, 1008504 (Presented at SPIE LASE: January 31, 2017; Published: 22 February 2017); https://doi.org/10.1117/12.2253442.
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