To reduce the diode laser bar’s smile effect induced by packaging, a method based on a chip mounter is presented. When the bare bar is picked up by the pick-up tool (PUT) of the chip mounter, the curve direction and volume of the bar can be measured by scanning the P side surface of the bar with a laser rangefinder, and they can be controlled through adjusting the setting up of the PUT. By controlling the curve direction and volume at an appropriate state to compensate the packaging induced strain, the obtaining smile effect is restricted within 0.5μm steadily.
Guannan Jia, Shun Yao, Xiaoying Luo, Jian Cheng, and Zhiyong Wang, "The smile effect reduction of diode laser bar by bare bar curve control," Proc. SPIE 10085, Components and Packaging for Laser Systems III, 100850D (Presented at SPIE LASE: February 01, 2017; Published: 22 February 2017); https://doi.org/10.1117/12.2250017.
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