The selective metallization on a flexible polymer film via laser direct writing and the following additive metallization process was studied as an alternate to conventional semi-additive process in the fabrication of printed circuit board. A Cu micropattern was fabricated on a polyimide film via CW blue-violet laser direct writing using a Cu nanoparticle ink and applied to a seed layer for the Cu electroplating. The on-demand processing of a Cu micropattern whose line width and thickness are ca. 5 and 2 μm, respectively, was achieved by combination of a laser-written seed micropattern and the following electro-plating. The homogeneity of the Cu micropatterns prepared from Cu nanoparticles was easily improved by combination with the following Cu plating.
Akira Watanabe and Jinguang Cai, "Selective metallization based on laser direct writing and additive metallization process," Proc. SPIE 10092, Laser-based Micro- and Nanoprocessing XI, 100920Z (Presented at SPIE LASE: February 02, 2017; Published: 17 February 2017); https://doi.org/10.1117/12.2251167.
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