During the last years there has been significant interest in the fabrication of conductive three-dimensional (3D) structures on the micrometer scale due to their potential applications in microelectronics or emerging fields such as flexible electronics, nanophotonics, and plasmonics. Two-photon direct laser writing (DLW) has been proposed as a potential tool for the fabrication of 3D microstructures in various contexts. The majority of these two-photon processes involve the preparation of insoluble polymeric networks using photopolymerizable photoresins based on acrylate or epoxy groups. Nevertheless, the preparation of conductive 3D microstructures is still very challenging.
The aim of the current work has been the preparation of conductive 3D microstructures via DLW by employing a newly developed photoresist. The photoresist consists of acrylate-functionalized poly(ethylene glycol) derivates and HAuCl4 as the gold precursor. By varying the gold content of the photoresist, different structures have been prepared and characterized by SEM and XPS. Conductivity of individual wires between prefabricated macroelectrodes has been measured too. Subsequently, the material has been employed to demonstrate the possibility of true 3D microscale connections.
Eva Blasco, Jonathan B. Müller, Patrick Müller, Andreas C. Fischer, Christopher Barner-Kowollik, and Martin Wegener, "Fabrication of 3D gold/polymer conductive microstructures via direct laser writing (Conference Presentation)," Proc. SPIE 10095, Laser 3D Manufacturing IV, 1009504 (Presented at SPIE LASE: January 30, 2017; Published: 19 April 2017); https://doi.org/10.1117/12.2256873.5389862339001.
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