Recently infrared laser has faced resolution limit of finer micromachining requirement on especially semiconductor packaging like Fan-Out Wafer Level Package (FO-WLP) and Through Glass Via hole (TGV) which are hard to process with less defect. In this study, we investigated ablation rate with deep ultra violet excimer laser to explore its possibilities of micromachining on organic and glass interposers. These results were observed with a laser microscopy and Scanning Electron Microscope (SEM). As the ablation rates of both materials were quite affordable value, excimer laser is expected to be put in practical use for mass production.
Junichi Fujimoto, Masakazu Kobayashi, Koji Kakizaki, Hiroaki Oizumi, Toshio Mimura, Takashi Matsunaga, and Hakaru Mizoguchi, "193nm high power lasers for the wide bandgap material processing," Proc. SPIE 10097, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VI, 100970T (Presented at SPIE LASE: February 02, 2017; Published: 22 February 2017); https://doi.org/10.1117/12.2250706.
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