Widespread deployment of silicon photonics will benefit strongly from improved high-port-density interconnect solutions between chips, interposers, and other waveguide fabrics. We present an adiabatic silicon waveguide to polymer waveguide coupler design incorporating strong vertical asymmetries offering high efficiency, small footprint, and improved tolerance to lateral misalignment. The design incorporates a standard 450nm-wide silicon waveguide tapered down to 50nm over a distance of 200μm with a 1.6μm-thick polymer waveguide having a 4μm-wide core atop the taper. The coupler exhibits <0.1dB loss for both TE and TM modes based on 3-dimensional finite element modeling. Moreover, the modeled device exhibits less than 0.1dB excess loss with lateral misalignment of +/–2μm between polymer and silicon waveguide for TE mode, and 0.2dB excess loss with +/–1.6μm offset for the TM mode, and 1dB excess loss for both TE and TM modes with +/–2.7μm misalignment. This taper design should enable reduction in manufacturing costs due to a reduced on-chip footprint and the potential for lower-precision, higher-throughput assembly tools. The authors would like to acknowledge the support of AIM Photonics. This material is based on research sponsored by Air Force Research Laboratory under agreement number FA8650-15-2-5220. The U.S. Government is authorized to reproduce and distribute reprints for Governmental purposes notwithstanding any copyright notation thereon. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of Air Force Research Laboratory or the U.S. Government.
Erfan Fard, Robert A. Norwood, Nasser N. Peyghambarian, and Thomas L. Koch, "Relaxed tolerance adiabatic silicon coupler for high I/O port-density optical interconnects (Conference Presentation)," Proc. SPIE 10106, Integrated Optics: Devices, Materials, and Technologies XXI, 101060S (Presented at SPIE OPTO: January 31, 2017; Published: 19 April 2017); https://doi.org/10.1117/12.2253545.5393342279001.
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