We introduce an ultra-compact plasmonic sensor for lab on chip applications. The device utilizes the heavily doped Si for introducing plasmonic effects. The use of heavily doped silicon instead of metals for plasmonic excitation has the advantage of reduced losses and CMOS compatibility. The proposed device has a simple structure, also it can be easily fabricated using the mature CMOS fabrication technology. The device structure is made of a heavily doped silicon layer, on a silicon dioxide substrate, while the silicon layer is etched to form a slot waveguide, and a rectangular cavity. The proposed plasmonic resonator is operational in the mid infrared spectral region. The sensor possesses a high sensitivity of 5000nm/RIU in the mid infrared range.
S. M. Sherif and M. Swillam, "Silicon-plasmonic-integrated mid-infrared sensor using CMOS technology," Proc. SPIE 10112, Photonic and Phononic Properties of Engineered Nanostructures VII, 101120V (Presented at SPIE OPTO: February 01, 2017; Published: 20 February 2017); https://doi.org/10.1117/12.2251356.
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