We use the ZEISS MultiSEM to inspect patterns on separated chips of a semiconductor wafer suited for process window characterization at imec-N10 logic node. We systematically analyze the impact of imaging parameters of the MultiSEM on quantitative metrics extracted from the images, e.g., CD repeatability and relative defect capture, and demonstrate that the MultiSEM is able to image the wafer patterns, track their variations through the process conditions of the lithography scanner, and consistently find patterning defects limiting the lithographic process window.
J. T. Neumann, T. Garbowski, W. Högele, T. Korb, S. Halder, P. Leray, R. Garreis, M. le Maire, and D. Zeidler, "High-throughput multi-beam SEM: quantitative analysis of imaging capabilities at IMEC-N10 logic node," Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 101451S (Presented at SPIE Advanced Lithography: March 02, 2017; Published: 28 March 2017); https://doi.org/10.1117/12.2257980.
Conference Presentations are recordings of oral presentations given at SPIE conferences and published as part of the conference proceedings. They include the speaker's narration along with a video recording of the presentation slides and animations. Many conference presentations also include full-text papers. Search and browse our growing collection of more than 14,000 conference presentations, including many plenary and keynote presentations.