High chi organic lamellar-forming block copolymers were prepared with 18 nm intrinsic period Lo value. The BCPs were coated on a neutral layer on silicon substrates and were either thermally annealed or exposed to solvent vapors both in a 300mm track. The effect of lowering the glass transition temperature (Tg) on the high chi BCP was investigated. Process temperatures and times were varied. It was found that the BCP having lower Tg exhibits faster kinetics and is able to reach alignment in a shorter time than a similar BCP having higher Tg. Fingerprint defect analysis also shows that the BCP with lower Tg has lower defects. The results show that fingerprint formation can be achieved with either ether or ester type solvents depending on the BCP used. The results show that a track process for solvent annealing of high-χ BCPs is feasible and could provide the path forward for incorporation of BCP in future nodes. Finally, directed self-assembly was demonstrated by implemented high chi polymers on a graphoepitaxy test vehicles. CD and line width roughness was evaluated on patterns with a multiplication factor up to 7.
Douglas J. Guerrero, Kaumba Sakavuyi, Kui Xu, Ahmed Gharbi, Raluca Tiron, Isabelle Servin, Laurent Pain, Guillaume Claveau, Harold Stokes, Masahiko Harumoto, Célia Nicolet, and Xavier Chevalier, "A high chi track-compatible DSA for sub-10nm L/S patterning
," Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 101460W (Presented at SPIE Advanced Lithography: March 01, 2017; Published: 27 March 2017); https://doi.org/10.1117/12.2261094.
Conference Presentations are recordings of oral presentations given at SPIE conferences and published as part of the conference proceedings. They include the speaker's narration along with a video recording of the presentation slides and animations. Many conference presentations also include full-text papers. Search and browse our growing collection of more than 12,000 conference presentations, including many plenary and keynote presentations.