With the increasing prevalence of complex device integration schemes, tri layer patterning with a solvent strippable hardmask can have a variety of applications. Spin-on metal hardmasks have been the key enabler for selective removal through wet strip when active areas need to be protected from dry etch damage. As spin-on metal hardmasks require a dedicated track to prevent metal contamination, and are limited in their ability to scale down thickness without comprising on defectivity, there has been a need for a deposited hardmask solution. Modulation of film composition through deposition conditions enables a method to create TiO2 films with wet etch tunability. This paper presents a systematic study on development and characterization of PEALD deposited TiO2-based hardmasks for patterning applications. We demonstrate lithographic process window, pattern profile, and defectivity evaluation for a tri layer scheme patterned with PEALD based TiO2 hardmask and its performance under dry and wet strip conditions. Comparable structural and electrical performance is shown for a deposited vs a spin-on metal hardmask.
Anuja De Silva, Indira Seshadri, Kisup Chung, Abraham Arceo, Luciana Meli, Brock Mendoza, Yasir Sulehria, Yiping Yao, Madhana Sunder, Hao Truong, Shravan Matham, Ruqiang Bao, Heng Wu, Nelson M. Felix, and Sivananda Kanakasabapathy, "Development of TiO2 containing hardmasks through PEALD deposition," Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 1014615 (Presented at SPIE Advanced Lithography: March 02, 2017; Published: 27 March 2017); https://doi.org/10.1117/12.2258380.
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