Lithographic patterning limits can be a cost-barrier that delays advancement to new nodes. This paper
introduces a cost-saving design method that enables a maskless via. Multi-patterning or coloring of a
design is a technique that is used at advanced nodes to aid in patterning. Coloring allows designers to
designate different patterns on one level to be printed with different masks. Stitch overlap via (SOV) is a
coloring technique introduced herein. SOV utilizes via-aware coloring and a unique process flow to print
a maskless via. Identification of qualifying design structures is achieved through a custom program. The
program inputs the design level of the multipatterned layer and the via levels above and below to
determine the coloring decomposition. Vias are a particularly challenging layer to print due to the
dimensions required for these pillars. SOV is a methodology for identifying qualifying multi-patterned
layouts and replacing them with a new design that enables a maskless via layer.
D. Civay and E. Laffosse, "Stitch overlap via coloring technique enables maskless via," Proc. SPIE 10148, Design-Process-Technology Co-optimization for Manufacturability XI, 101480R (Presented at SPIE Advanced Lithography: March 02, 2017; Published: 28 March 2017); https://doi.org/10.1117/12.2258640.
Conference Presentations are recordings of oral presentations given at SPIE conferences and published as part of the conference proceedings. They include the speaker's narration along with a video recording of the presentation slides and animations. Many conference presentations also include full-text papers. Search and browse our growing collection of more than 14,000 conference presentations, including many plenary and keynote presentations.
Study of self-shadowing effect as a simple means to realize nanostructured thin films and layers with special attentions to birefringent obliquely deposited thin films and photo-luminescent porous silicon