From Event: SPIE Commercial + Scientific Sensing and Imaging, 2017
Novel materials and printing technologies can enable rapid and low cost prototyping and manufacturing of electronic devices with increased flexibility and complexity. However, robust and on-demand printing of circuits will require accurate metrology methods that can measure micron level patterns to verify proper production. This paper presents an evaluation of a range of optical gaging tools ranging from confocal to area 3D systems to determine metrological capability for a range of key parameters from trace thickness to solder paste volumes. Finally, this paper will present a select set of optimized measurement tools detailing both capabilities and gaps in the available technologies needed to fully realize the potential of printed electronics.
Vadim Bromberg and Kevin Harding, "Three-dimensional metrology for printed electronics," Proc. SPIE 10220, Dimensional Optical Metrology and Inspection for Practical Applications VI, 102200I (Presented at SPIE Commercial + Scientific Sensing and Imaging: April 13, 2017; Published: 1 May 2017); https://doi.org/10.1117/12.2263475.
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