From Event: SPIE Optical Engineering + Applications, 2017
A novel in-plane and out-of-plane deformation simultaneous measurement method using only two speckle patterns grabbed before and after deformation of an object with rough surfaces has been proposed. Then, the same measurement sensitivities in three directions can be set in this system. However, the method has some area which cannot measure a deformation. In this paper, new optical system which is not based on orthogonal laser beams is proposed to expand the measurement area of the method under consideration of measurement sensitivity. The improvement of deformation measurement area where the deformation distribution cannot be measured by the conventional optical system is discussed in the proposed method.
Y. Arai, "Expansion of measurement area of three-dimensional deformation measurement speckle interferometry with same sensitivities in three directions under consideration of measurement sensitivity," Proc. SPIE 10373, Applied Optical Metrology II, 1037305 (Presented at SPIE Optical Engineering + Applications: August 08, 2017; Published: 23 August 2017); https://doi.org/10.1117/12.2270733.
Conference Presentations are recordings of oral presentations given at SPIE conferences and published as part of the conference proceedings. They include the speaker's narration along with a video recording of the presentation slides and animations. Many conference presentations also include full-text papers. Search and browse our growing collection of more than 14,000 conference presentations, including many plenary and keynote presentations.
Study of self-shadowing effect as a simple means to realize nanostructured thin films and layers with special attentions to birefringent obliquely deposited thin films and photo-luminescent porous silicon