From Event: SPIE Optical Engineering + Applications, 2017
The short-wavelength infrared (SWIR) InGaAs focal plane array (FPA) detector consists of infrared detector chip, readout integrated circuit (ROIC), and flip-chip bonding interconnection by Indium bump. In order to satisfy space application requirements for failure rates or Mean Time to Failure (MTTF), which can only be demonstrated with the large number of detectors manufactured, the single pixel in InGaAs FPAs was chosen as the research object in this paper. The constant-stress accelerated life tests were carried out at 70°C，80°C，90°C and100°C. The failed pixels increased gradually during more than 14000 hours at each elevated temperatures. From the random failure data the activation energy was estimated to be 0.46eV, and the average lifetime of a single pixel in InGaAs FPAs was estimated to be longer than 1E+7h at the practical operating temperature (5°C).
Xian-Liang Zhu, Hai-Yan Zhang, Xue Li, Zhang-Cheng Huang, and Hai-Mei Gong, "Life test of the InGaAs focal plane arrays detector for space applications," Proc. SPIE 10404, Infrared Sensors, Devices, and Applications VII, 104040E (Presented at SPIE Optical Engineering + Applications: August 09, 2017; Published: 30 August 2017); https://doi.org/10.1117/12.2273591.
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