In this paper, we propose a technique called time-varying frequency scanning (TVFS) to meet the challenges in killer defect inspection. The proposed technique enables the dynamic monitoring of defects by checking the hopping in the instantaneous frequency data and the classification of defect types by comparing the difference in frequencies. The TVFS technique utilizes the bidimensional empirical mode decomposition (BEMD) method to separate the defect information from the sea of system errors. This significantly improve the signal-to-noise ratio (SNR) and moreover, it potentially enables reference-free defect inspection.
Jinlong Zhu and Lynford L. Goddard, "Defect inspection using a time-domain mode decomposition technique," Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 1058508 (Presented at SPIE Advanced Lithography: February 26, 2018; Published: 13 March 2018); https://doi.org/10.1117/12.2297443.
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