This paper will provide an update to previous works  to our view of the future for in-line high volume manufacturing (HVM) metrology for the semiconductor industry, concentrating on logic technology for foundries. First, we will review of the needs of patterned defect, critical dimensional (CD/3D), overlay and films metrology, and present the extensive list of applications for which metrology solutions are needed. We will then update the industry’s progress towards addressing gating technical limits of the most important of these metrology solutions, highlighting key metrology technology gaps requiring industry attention and investment.
Benjamin Bunday, A. F. Bello, Eric Solecky, and Alok Vaid, "7/5nm logic manufacturing capabilities and requirements of metrology," Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105850I (Presented at SPIE Advanced Lithography: February 27, 2018; Published: 22 March 2018); https://doi.org/10.1117/12.2296679.
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