Via failure has always been a significant yield detractor caused by random and systematic defects. Introducing redundant vias or via bars into the design can alleviate the problem significantly  and has, therefore, become a standard DFM procedure . Applying rule-based via bar insertion to convert millions of via squares to via bar rectangles, in all possible places where enough room could be predicted, is an efficient methodology to maximize the redundancy rate. However, inserting via bars can result in lithography hotspots. A Pattern Manufacturability (PATMAN) model is proposed, to maximize the Redundant Via Insertion (RVI) rate in a reasonable runtime, while insuring lithography friendly insertion based on the accumulated DFM learnings during the yield ramp.
Ahmed Mounir Elsemary, Moutaz Fakhry, Janam Bakshi, Nishant Shah, Mohamed Ismail, Fadi Batarseh, Uwe Paul Schroeder, Ahmed Mohyeldin, and Jason Cain, "Litho friendly via insertion with in-design auto-fix flow using machine learning," Proc. SPIE 10588, Design-Process-Technology Co-optimization for Manufacturability XII, 105880F (Presented at SPIE Advanced Lithography: March 01, 2018; Published: 4 April 2018); https://doi.org/10.1117/12.2297499.
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