This paper discusses the approach and solution adopted by GLOBALFOUNDRIES, a high volume manufacturing (HVM) foundry, for dry-etch related edge-signature surface particle defects issue facing the sub-nm node in the gate-etch sector. It is one of the highest die killers for the company in the 14-nm node. We have used different approaches to attack and rectify the edge signature surface particle defect. Several process-related & hardware changes have been successively implemented to achieve defect reduction improvement by 63%. Each systematic process and/or hardware approach has its own unique downstream issues and they have been dealt in a route-cause-effect technique to address the issue.
Supriya Ketkar, Junhan Lee, Sen Asokamani, Winston Cho, and Shailendra Mishra, "Advanced process and defect characterization methodology to support process development of advanced patterning structures," Proc. SPIE 10589, Advanced Etch Technology for Nanopatterning VII, 105890F (Presented at SPIE Advanced Lithography: February 27, 2018; Published: 20 March 2018); https://doi.org/10.1117/12.2297451.
Conference Presentations are recordings of oral presentations given at SPIE conferences and published as part of the conference proceedings. They include the speaker's narration along with a video recording of the presentation slides and animations. Many conference presentations also include full-text papers. Search and browse our growing collection of more than 12,000 conference presentations, including many plenary and keynote presentations.