In this paper we describe our work on heterogeneously integrated laser diodes on a silicon photonics platform. Different types of laser diodes are presented, different both in terms of wavelength / material platform (850 nm, 1550nm, 2000nm, 2300nm) as well as laser geometry. The integration of the III-V semiconductor materials on the silicon photonic integrated circuits is realized through adhesive die-to-wafer bonding. We will report on the realization of hybrid 850 nm VCSELs and high-speed directly and externally modulated lasers, mode-locked lasers and tunable lasers in the C-band. We also discuss our work on single wavelength laser arrays and tunable lasers in the 2um wavelength range. These integrated laser sources complete the toolkit for silicon photonics enabling highly integrated solutions for optical communication and sensing applications.
Conference Presentations are recordings of oral presentations given at SPIE conferences and published as part of the conference proceedings. They include the speaker's narration along with a video recording of the presentation slides and animations. Many conference presentations also include full-text papers. Search and browse our growing collection of more than 16,000 conference presentations, including many plenary and keynote presentations.