From Event: SPIE Optical Engineering + Applications, 2018
We discuss the application of new synchronized, and virtually synchronized multiprobe real space and frequency domain low coherence interferometers for measurement of wafer thickness and topography. The recently developed low coherence frequency domain interferometers have been proved to be fast and effective tool for measurement of wafer topography, thickness and individual layers within multilayer structures. In our paper we present simple models describing performance of multiprobe metrology and compare it with other solutions.
Raphael Morency, Wei Chun Hung, and Wojtek J. Walecki, "Synchronized real-space and frequency-domain low-coherence interferometry for wafer thickness and metrology applications," Proc. SPIE 10749, Interferometry XIX, 107490Z (Presented at SPIE Optical Engineering + Applications: August 23, 2018; Published: 18 August 2018); https://doi.org/10.1117/12.2317579.
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