Extreme ultraviolet (EUV) lithography, using 13.5 nm radiation, is a prominent candidate for next generation manufacturing. Our main effort has recently focused on metal organic cluster photoresists, including both Zr and Hf metal oxides, both relatively low EUV absorbing metals. However, integration of high EUV absorption elements is now considered to be a more promising route to further improve lithographic performance under EUV radiation. Here, we report lithography of zinc oxide-based metal organic cluster photoresists, and EUV patterning below 15 nm. The lithographic performance of this and other metal oxides is described and etch characteristics discussed.

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Kazunori Sakai, Seok-Heon Jung, Wenyang Pan, Emmanuel P. Giannelis, and Christopher K. Ober, "Metal organic cluster photoresists: new metal oxide systems," Proc. SPIE 10963, Advanced Etch Technology for Nanopatterning VIII, 1096306 (Presented at SPIE Advanced Lithography: February 26, 2019; Published: 20 March 2019); https://doi.org/10.1117/12.2515148.