Damage characterization often requires direct sensing due to the localization of the anomalous behavior near the cracks. Direct sensing, however, is expensive because of the need to deploy a dense array of individual sensors. Sensing sheets based on Large Area Electronics (LAE) and Integrated Circuits (ICs) are a novel solution to this problem. Such sensing sheets could span several square meters, with a dense array of strain sensors embedded on a polyimide substrate along with the relevant electronics allowing for direct sensing while keeping the costs low. Current studies on LAE based sensing sheets are limited to laboratory experiments. This paper explores the question of suitability of the sensing sheets as a viable option for real-life SHM based on LAE and ICs. Results of laboratory experiments on an aluminum beam are provided to demonstrate the performance of sensing sheets in ideal conditions. Then, the sensing sheets are employed on a pedestrian bridge already equipped with fiber-optic sensors. The strain measurements from the sensing sheets and the fiber-optic sensors are compared and sources of differences are discussed.
Vivek Kumar, Levent E. Aygun, Naveen Verma, James C. Sturm, and Branko Glisic, "Sensing sheets based on large area electronics for structural health monitoring of bridges," Proc. SPIE 10970, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2019, 109702G (Presented at SPIE Smart Structures + Nondestructive Evaluation: March 08, 2019; Published: 27 March 2019); https://doi.org/10.1117/12.2514223.
Conference Presentations are recordings of oral presentations given at SPIE conferences and published as part of the proceedings. They include the speaker's narration with video of the slides and animations. Most include full-text papers. Interactive, searchable transcripts and closed captioning are now available for most presentations.
Search our growing collection of more than 18,000 conference presentations, including many plenaries and keynotes.