Electronic devices are continually evolving to offer improved performance, smaller sizes, lower weight, and reduced costs, often requiring state of the art manufacturing and materials to do so. An emerging class of materials and fabrication techniques, inspired by self-assembling biological systems shows promise as an alternative to the more traditional methods that are currently used in the microelectronics industry. Mimicking unique features of natural systems, namely flexibility and shapeability, the geometry of initially planar microelectronic structures can be tailored. Heavily relying on cylindrical geometry, fabrication of RF components as well as magnetic sensors is challenging, when conventional fabrication techniques are applied. Involving novel self-assembly strategies realization of these spatially non-trivial devices in a compact form and with a reduced number of fabrication steps become feasible. This spatial self-assembly process, triggered by an external stimulus, offers a possibility of an improved performance while reducing overall manufacturing complexity of devices and components by harnessing the relative ease in which it can produce mesoscopic 3D geometries such as a “Swiss-roll” architecture. These benefits can lead to system integration of electronic and magnetoelectronic components including circuits, capacitors, coils, sensors and antennas with reduced costs fabricated from a single wafer.

© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.

Daniil Karnaushenko and Christian Becker, "Shapeable material technologies: 3D magnetoelectronics (Conference Presentation)," Proc. SPIE 11090, Spintronics XII, 110903P (Presented at SPIE Nanoscience + Engineering: August 15, 2019; Published: 10 September 2019); https://doi.org/10.1117/12.2528732.6083795913001.