From Event: SPIE LASE, 2023
We describe how to improve micro-processing using Second Harmonic Generation of a Ultra-Short Pulse laser combined with a Multi-Plane Light Conversion beam-shaper.
Manufacturing at 515nm presents advantages compared to 1030nm : extended depth of field, higher sharpness, and higher ablation efficiency for some materials. The beam-shaper provides a square top-hat with a 1/10 sharpness and an extended depth of field up to 10 times higher compared to other beam-shaping technologies.
We describe process results of different metal samples: LIPSS generation with a 100µm square targeting a period down to 0,5µm and holes drilling holes of a diameter smaller than 10µm.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Clément Jacquard, Kathrin Placzek, Daniel Holder, Dmitry Nuzhdin, Mahmoud Ziat, Ivan Gusachenko, Gwenn Pallier, Guillaume Labroille, and Pu Jian, "Microprocessing with a multi-plane light conversion beam shaper and a femtosecond laser at 515nm," Proc. SPIE 12409, Laser-based Micro- and Nanoprocessing XVII, 1240910 (Presented at SPIE LASE: February 02, 2023; Published: 17 March 2023); https://doi.org/10.1117/12.2655447.6321502762112.