From Event: SPIE LASE, 2023
Microscale selective laser sintering (μ-SLS) is a high throughput additive manufacturing (AM) technique developed at The University of Texas at Austin. It can fabricate high aspect ratio metal interconnect structures such as micro-pillar arrays for applications in semiconductor packaging. Additionally, as an AM process, μ-SLS aims to create complex 3D structures at a throughput that cannot be achieved by multi-step lithography processes.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Aaron Liao, Joshua Grose, Farzana Tasnim, and Michael Cullinan, "Additive manufacturing of metal interconnects using microscale selective laser sintering," Proc. SPIE 12410, Nanoscale and Quantum Materials: From Synthesis and Laser Processing to Applications 2023, 1241005 (Presented at SPIE LASE: January 29, 2023; Published: 15 March 2023); https://doi.org/10.1117/12.2655264.