RTI has developed a photodiode technology based on solution-processed PbS colloidal quantum dots (CQD). These devices are capable of providing low-cost, high performance detection across the Vis-SWIR spectral range. At the core of this technology is a heterojunction diode structure fabricated using techniques well suited to wafer-scale fabrication, such as spin coating and thermal evaporation. This enables RTI’s CQD diodes to be processed at room temperature directly on top of read-out integrated circuits (ROIC), without the need for the hybridization step required by traditional SWIR detectors. Additionally, the CQD diodes can be fabricated on ROICs designed for other detector material systems, effectively allowing rapid prototype demonstrations of CQD focal plane arrays at low cost and on a wide range of pixel pitches and array sizes.
We will show the results of fabricating CQD arrays directly on top of commercially available ROICs. Specifically, the ROICs are a 640 x 512 pixel format with 15 µm pitch, originally developed for InGaAs detectors. We will show that minor modifications to the surface of these ROICs make them suitable for use with our CQD detectors. Once completed, these FPAs are then assembled into a demonstration camera and their imaging performance is evaluated. In addition, we will discuss recent advances in device architecture and processing resulting in devices with room temperature dark currents of 2-5 nA/cm^2 and sensitivity from 350 nm to 1.7 μm.
This combination of high performance, dramatic cost reduction, and multi-band sensitivity is ideally suited to expand the use of SWIR imaging in current applications, as well as to address applications which require a multispectral sensitivity not met by existing technologies.
Ethan J. D. Klem, Christopher W. Gregory, Dorota S. Temple, and Jay S. Lewis, "Colloidal quantum dot Vis-SWIR imaging: demonstration of a focal plane array and camera prototype (Presentation Recording)," Proc. SPIE 9555, Optical Sensing, Imaging, and Photon Counting: Nanostructured Devices and Applications, 955505 (Presented at SPIE Nanoscience + Engineering: August 11, 2015; Published: 5 October 2015); https://doi.org/10.1117/12.2190372.4519371145001.
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