Structural health monitoring (SHM) has attracted researchers’ interests for the past two decades to reinforce the maintenance of the aging infrastructure systems all over the world. As one of the potential solutions, the electro-mechanical impedance (EMI) method was introduced in the early 1990s and has a great number of potential applications in the SHM of civil, mechanical and aerospace industries. This paper studied the impedance-based technique with the presence of environmental/operational variability, especially the influences of temperature and uniaxial stress on the admittance signature-based features. A comprehensive analytical model is established and provides satisfactory agreements with the experimental results. The stress and temperature sensitivities of all the proposed features are quantified using the experimental measurements, with discussions on their advantages and disadvantages. The final results illustrate that the EMI method can potentially provide effective measure for thermal stress.
Xuan Zhu, Francesco Lanza di Scalea, and Mahmood Fateh, "Thermal stress characterization using the impedance-based structural health monitoring system," Proc. SPIE 9799, Active and Passive Smart Structures and Integrated Systems 2016, 97990B (Presented at SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring: March 21, 2016; Published: 15 April 2016); https://doi.org/10.1117/12.2218544.
Conference Presentations are recordings of oral presentations given at SPIE conferences and published as part of the proceedings. They include the speaker's narration with video of the slides and animations. Most include full-text papers. Interactive, searchable transcripts and closed captioning are now available for most presentations.
Search our growing collection of more than 25,000 conference presentations, including many plenaries and keynotes.