From Event: SPIE Organic Photonics + Electronics, 2016
Wireless sensing has broad applications in a wide variety of fields such as infrastructure monitoring, chemistry, environmental engineering and cold supply chain management. Further development of sensing systems will focus on achieving light weight, flexibility, low power consumption and low cost. Fully printed electronics provide excellent flexibility and customizability, as well as the potential for low cost and large area applications, but lack solutions for high-density, high-performance circuitry. Conventional electronics mounted on flexible printed circuit boards provide high performance but are not digitally fabricated or readily customizable. Incorporation of small silicon dies or packaged chips into a printed platform enables high performance without compromising flexibility or cost.
At PARC, we combine high functionality c-Si CMOS and digitally printed components and interconnects to create an integrated platform that can read and process multiple discrete sensors. Our approach facilitates customization to a wide variety of sensors and user interfaces suitable for a broad range of applications including remote monitoring of health, structures and environment. This talk will describe several examples of printed wireless sensing systems. The technologies required for these sensor systems are a mix of novel sensors, printing processes, conventional microchips, flexible substrates and energy harvesting power solutions.
Ping Mei, Gregory L. Whiting, David E. Schwartz, Tse Nga Ng, Brent S. Krusor, Steve E. Ready, George Daniel, Janos Veres, and Bob Street, "Integrated digital printing of flexible circuits for wireless sensing
(Conference Presentation)," Proc. SPIE 9945, Printed Memory and Circuits II, 99450F (Presented at SPIE Organic Photonics + Electronics: September 01, 2016; Published: 7 November 2016); https://doi.org/10.1117/12.2238560.5169177902001.
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