From Event: SPIE Optical Engineering + Applications, 2016
State of the art fabrication of LED modules based on chip-on-board (COB) technology comprises some shortcomings
both with respect to the manufacturing process itself but also with regard to potential sources of failures and
manufacturing impreciseness. One promising alternative is additive manufacturing, a technology which has gained a lot
of attention during the last years due to its materials and cost saving capabilities. Especially direct-write technologies like
Aerosol jet printing have demonstrated advantages compared to other technological approaches when printing high
precision layers or high precision electronic circuits on substrates which, as an additional advantage, also can be flexible
and 3D shaped. Based on test samples and test structures manufactured by Aerosol jet printing technology, in this
context we discuss the potentials of additive manufacturing in various aspects of LED module fabrication, ranging from
the deposition of the die-attach material, wire bond replacement by printed electrical connects as well as aspects of high-precision
phosphor layer deposition for color conversion and white light generation.
Andreas Rudorfer, Martin Tscherner, Christian Palfinger, Frank Reil, Paul Hartmann, Ioannis E. Seferis, Eugeniusz Zych, and Franz P. Wenzl, "A study on Aerosol jet printing technology in LED module manufacturing," Proc. SPIE 9954, Fifteenth International Conference on Solid State Lighting and LED-based Illumination Systems, 99540E (Presented at SPIE Optical Engineering + Applications: August 31, 2016; Published: 7 September 2016); https://doi.org/10.1117/12.2237737.
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