From Event: SPIE Optical Engineering + Applications, 2016
Applying of a phase-shifting digital holography combined with compressive sensing to inspect the soldering quality of
surface mount technology (SMT) which is a method for producing electronic circuits. In SMT, the components are
mounted and connected with each other directly onto the surface of printed circuit boards (PCBs). By reconstructing the
multidimensional images from a few samples of SMT, the results are solved by an optimization problem. In this paper,
two problems have been concerned. The first one is to examine the devices and the soldering quality of connections
between them, which are in micro-scaled. The second is to observe the effect of heat treatment of soldering material and
devices on the surface mount board.
Chantira Boonsri and Prathan Buranasiri, "Quality investigation of surface mount technology using phase-shifting digital holography," Proc. SPIE 9970, Optics and Photonics for Information Processing X, 99700A (Presented at SPIE Optical Engineering + Applications: August 29, 2016; Published: 14 September 2016); https://doi.org/10.1117/12.2237595.
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