Nowadays surface acoustic wave (SAW) sensors are produced using a photolithography method. In case of inertial sensors it suffers several disadvantages, such as difficulty in matching topologies produced on opposite sides of the wafer, expensive in small series production, not allowing further topology correction. In this case a laser ablation method seems promising. Details of a proposed technique are described in the paper along with results of its experimental test and discussion.
Dmitry Lukyanov, Sergey Shevchenko, Alexander Kukaev, and Daniil Safronov, "Laser ablation method for production of surface acoustic wave sensors," Proc. SPIE 9986, Unmanned/Unattended Sensors and Sensor Networks XII, 99860G (Presented at SPIE Security + Defence: September 27, 2016; Published: 21 October 2016); https://doi.org/10.1117/12.2242005.
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