From Event: SPIE Advanced Lithography + Patterning, 2023
Laser Direct Imaging (LDI) systems have transformed printed circuit board (PCB) manufacturing to evolve from the traditional film-based lithography to maskless systems. Since their introduction LDI systems have made great advances to higher throughputs, finer resolutions, automated distortion compensation, and full process automation without operator intervention. LDI systems have reduced costs while giving PCB manufacturers much greater flexibility.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Philip Paul and Christian Bach, "Industrial maskless aligner: new levels of flexibility in lithography," Proc. SPIE PC12497, Novel Patterning Technologies 2023, PC1249705 (Presented at SPIE Advanced Lithography + Patterning: February 28, 2023; Published: 30 April 2023); https://doi.org/10.1117/12.2658504.6325349560112.