From Event: SPIE Advanced Lithography + Patterning, 2023
The continued acceleration in dimensional scaling of logic and memory semiconductor devices requires the integration of more emerging multifunctional materials, which demand more complex and aggressive chemical processes, thereby heightening the environmental, health and safety risks. To realize the sustainability in etch and patterning integration, a three pronged approach must be undertaken. First, new alternative gases must be developed to replace hydrofluorocarbon (HFC) gases. Next, mitigating strategies must be developed to minimize any downstream reaction that can cause serious health and safety incidents. Finally, non-HFC/non-halogen etch chemistries must be tested to demonstrate feasibility in patterning nano-scale structures.
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Jane P. Chang and Owen Watkins, "Engineering chemical processes for sustainability in patterning nano-electronics," Proc. SPIE PC12499, Advanced Etch Technology and Process Integration for Nanopatterning XII, PC124990F (Presented at SPIE Advanced Lithography + Patterning: March 02, 2023; Published: 30 April 2023); https://doi.org/10.1117/12.2661701.6325349060112.