PROCEEDINGS VOLUME 0470
1984 MICROLITHOGRAPHY CONFERENCES | 12-16 MARCH 1984
Optical Microlithography III: Technology for the Next Decade
IN THIS VOLUME

0 Sessions, 30 Papers, 0 Presentations
All Papers  (30)
1984 MICROLITHOGRAPHY CONFERENCES
12-16 March 1984
Santa Clara, United States
All Papers
Proc. SPIE 0470, VHSIC - A Test Bed For Advanced Lithography, 0000 (29 June 1984); doi: 10.1117/12.941876
Proc. SPIE 0470, Submicron Optical Lithography: I-Line Lens And Photoresist Technology, 0000 (29 June 1984); doi: 10.1117/12.941878
Proc. SPIE 0470, How Process Technology Can Make Submicron Photolithography Easier : Some Practical Examples., 0000 (29 June 1984); doi: 10.1117/12.941880
Proc. SPIE 0470, Anisotropic Plasma Etching Of Polysilicon With 100:1 Selectivity Over Thermal Oxide, 0000 (29 June 1984); doi: 10.1117/12.941882
Proc. SPIE 0470, Fine Line Patterning Of Al, Polysilicon, And Polycide, 0000 (29 June 1984); doi: 10.1117/12.941884
Proc. SPIE 0470, Applications Of The Square Count Yield Model, 0000 (29 June 1984); doi: 10.1117/12.941886
Proc. SPIE 0470, An Improved Alignment System For Wafer Steppers, 0000 (29 June 1984); doi: 10.1117/12.941888
Proc. SPIE 0470, Parameters Affecting The Ability To Align Aluminum Layers On An Optical Wafer Stepper, 0000 (29 June 1984); doi: 10.1117/12.941890
Proc. SPIE 0470, Fully Automated Alignment For Mos Device Processing On The Model 500 Full-Field Projection System, 0000 (29 June 1984); doi: 10.1117/12.941892
Proc. SPIE 0470, Multiple Layer Techniques In Optical Lithography: Applications To Fine Line Mos Production, 0000 (29 June 1984); doi: 10.1117/12.941894
Proc. SPIE 0470, Optimization Of Optimetrix Wafer Steppers In Very Large Scaled Integrated Circuit (VLSI) Process, 0000 (29 June 1984); doi: 10.1117/12.941896
Proc. SPIE 0470, Wafer Alignment Performance Through An MOS Process, 0000 (29 June 1984); doi: 10.1117/12.941898
Proc. SPIE 0470, Implementation Of Automatic Alignment Utilizing Electrical Wafer Probe Techniques, 0000 (29 June 1984); doi: 10.1117/12.941899
Proc. SPIE 0470, The Effect Of Semiconductor Processing Upon The Focusing Properties Of Fresnel Zone Plates Used As Alignment Targets, 0000 (29 June 1984); doi: 10.1117/12.941901
Proc. SPIE 0470, An Analysis Of Pellicle Parameters For Step-And-Repeat Projection, 0000 (29 June 1984); doi: 10.1117/12.941903
Proc. SPIE 0470, A Broadband Deep UV Pellicle For 1:1 Scanning Projection And Step And Repeat Lithography, 0000 (29 June 1984); doi: 10.1117/12.941905
Proc. SPIE 0470, Diffraction Characterization For Process Monitoring, Linewidth Measurement And Alignment, 0000 (29 June 1984); doi: 10.1117/12.941907
Proc. SPIE 0470, UV/Ozone Cleaning For Organics Removal On Silicon Wafers, 0000 (29 June 1984); doi: 10.1117/12.941910
Proc. SPIE 0470, Improvement Of Overlay And Focusing Accuracy Of Wafer Step-And-Repeat Aligners By Automatic Calibration, 0000 (29 June 1984); doi: 10.1117/12.941911
Proc. SPIE 0470, Automatic Self-Testing Of Machine-To-Machine Matching Of Wafer Steppers, 0000 (29 June 1984); doi: 10.1117/12.941913
Proc. SPIE 0470, Stabilization Of Single Layer And Multilayer Resist Patterns To Aluminum Etching Environments, 0000 (29 June 1984); doi: 10.1117/12.941915
Proc. SPIE 0470, Stepper Exposed Critical Dimension Tolerances Using The Vapor Jet Developer Nozzle, 0000 (29 June 1984); doi: 10.1117/12.941917
Proc. SPIE 0470, 160 Mpx/Sec Laser Pattern Generator For Mask And Reticle Production, 0000 (29 June 1984); doi: 10.1117/12.941919
Proc. SPIE 0470, Characterization Of Optical Properties Of Chromium Substrates And Linewidth Control For Mask Making, 0000 (29 June 1984); doi: 10.1117/12.941920
Proc. SPIE 0470, Optical Imaging With Phase Shift Masks, 0000 (29 June 1984); doi: 10.1117/12.941921
Proc. SPIE 0470, Automatic Inspection Of Contaminants On Reticles, 0000 (29 June 1984); doi: 10.1117/12.941922
Proc. SPIE 0470, Reticle Contamination Monitor For A Wafer Stepper, 0000 (29 June 1984); doi: 10.1117/12.941923
Proc. SPIE 0470, Cad As The Foundation For Quality Assurance In VLSI Fabrication, 0000 (29 June 1984); doi: 10.1117/12.941924
Proc. SPIE 0470, Process Control By Automated In-Process Wafer Inspection, 0000 (29 June 1984); doi: 10.1117/12.941925
Proc. SPIE 0470, EYESEE tm: A Computer Vision System For Inspection Of Integrated Circuits, 0000 (29 June 1984); doi: 10.1117/12.941926
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