PROCEEDINGS VOLUME 0775
MICROLITHOGRAPHY CONFERENCES | 2-6 MARCH 1987
Integrated Circuit Metrology, Inspection, & Process Control
IN THIS VOLUME

0 Sessions, 37 Papers, 0 Presentations
All Papers  (37)
MICROLITHOGRAPHY CONFERENCES
2-6 March 1987
Santa Clara, CA, United States
All Papers
Proc. SPIE 0775, Automatic Linewidth Control System, 0000 (17 April 1987); doi: 10.1117/12.940405
Proc. SPIE 0775, The Application Of Contour Maps And Statistical Control Charts In Monitoring Dielectric Processes, 0000 (17 April 1987); doi: 10.1117/12.940406
Proc. SPIE 0775, Using SEM Stereo To Extract Semiconductor Wafer Pattern Topography, 0000 (17 April 1987); doi: 10.1117/12.940407
Proc. SPIE 0775, Comparison Of Exposure Latitude For Single Layer Resist Processes, 0000 (17 April 1987); doi: 10.1117/12.940408
Proc. SPIE 0775, Electrical Method Of Determining Absolute Distortion In A 1X Wafer Stepper Independent Of Stage Precision, 0000 (17 April 1987); doi: 10.1117/12.940409
Proc. SPIE 0775, Submicrometer Optical Linewidth Metrology, 0000 (17 April 1987); doi: 10.1117/12.940410
Proc. SPIE 0775, A Study Of The Instrumental Errors In Linewidth And Registration Measurements Made With An Optical Microscope., 0000 (17 April 1987); doi: 10.1117/12.940411
Proc. SPIE 0775, Use Of A Confocal Scanning Laser Microscope For The Measurement Of Submicrometer Critical Dimensions, 0000 (17 April 1987); doi: 10.1117/12.940412
Proc. SPIE 0775, Analysis Of Linewidth Measurement Techniques Using The Low Voltage SEM, 0000 (17 April 1987); doi: 10.1117/12.940413
Proc. SPIE 0775, Low Voltage Sem Metrology For Pilot Line Applications, 0000 (17 April 1987); doi: 10.1117/12.940414
Proc. SPIE 0775, In-Process Linewidth Measurement Of Polysilicon Gates Using A Scanning Electron Microscope, 0000 (17 April 1987); doi: 10.1117/12.940415
Proc. SPIE 0775, Subnanometer-Precision SEM Measurements Of Proximity Effects In Contrast-Enhanced Lithography, 0000 (17 April 1987); doi: 10.1117/12.940416
Proc. SPIE 0775, A Contactless 3-D Measuring Technique For IC Inspection, 0000 (17 April 1987); doi: 10.1117/12.940417
Proc. SPIE 0775, A High Resolution Dimensional Metrology System For Masks, 0000 (17 April 1987); doi: 10.1117/12.940418
Proc. SPIE 0775, Microscop.Yap.Piied To Cirs,Registration And Inspection, 0000 (17 April 1987); doi: 10.1117/12.940419
Proc. SPIE 0775, A High-Precision, Wide Dynamic Range CCD Based Image Acquisition System, 0000 (17 April 1987); doi: 10.1117/12.940420
Proc. SPIE 0775, Accuracy Of Electron-Optical Measurements Of Critical Dimensions, 0000 (17 April 1987); doi: 10.1117/12.940421
Proc. SPIE 0775, Noise Contributions To Feature Dimension Measurement In A Scanning Electron Microscope (Sem), 0000 (17 April 1987); doi: 10.1117/12.940422
Proc. SPIE 0775, Improved Accuracy For SEM Linewidth Measurements, 0000 (17 April 1987); doi: 10.1117/12.940423
Proc. SPIE 0775, Submicrometer Dimensional Metrology In The Scanning Electron Microscope, 0000 (17 April 1987); doi: 10.1117/12.940424
Proc. SPIE 0775, Model Based Inspection Of Integrated Circuit Patterns Using The Scanning Electron Microscope (Sem), 0000 (17 April 1987); doi: 10.1117/12.940425
Proc. SPIE 0775, Applications Of A High-Speed, High-Resolution Metrology System, 0000 (17 April 1987); doi: 10.1117/12.940426
Proc. SPIE 0775, Characterization Of Two Level Overlay In X-Ray/Optical Stepper Mix And Match Lithography, 0000 (17 April 1987); doi: 10.1117/12.940427
Proc. SPIE 0775, Differential Linewidth Structures For Overlay Measurements At 0.25 Micron Ground Rules, 0000 (17 April 1987); doi: 10.1117/12.940428
Proc. SPIE 0775, Electrical And SEM Metrology Analyses Of Pattern Dimension Accuracy And Process Control In Direct Write Electron Beam Lithography, 0000 (17 April 1987); doi: 10.1117/12.940429
Proc. SPIE 0775, Plasma Etch Characterization Using Electrical Iinewidth Measuring Techniques, 0000 (17 April 1987); doi: 10.1117/12.940430
Proc. SPIE 0775, Automated Submicrometer Defect Detection During VLSI Circuit Production, 0000 (17 April 1987); doi: 10.1117/12.940431
Proc. SPIE 0775, Automated Product Test Wafer Procedure, 0000 (17 April 1987); doi: 10.1117/12.940432
Proc. SPIE 0775, An Application Of Interference Microscopy To Integrated Circuit Inspection And Metrology, 0000 (17 April 1987); doi: 10.1117/12.940433
Proc. SPIE 0775, Off-Line Quality Control In Integrated Circuit Fabrication Using Experimental Design, 0000 (17 April 1987); doi: 10.1117/12.940434
Proc. SPIE 0775, An Efficient Sample/Monte Carlo Methodology For Developing Robust Photolithography Processes, 0000 (17 April 1987); doi: 10.1117/12.940435
Proc. SPIE 0775, Statistical Process Control In Photolithography Applications, 0000 (17 April 1987); doi: 10.1117/12.940436
Proc. SPIE 0775, Experimental Design For Photoresist Characterization, 0000 (17 April 1987); doi: 10.1117/12.940437
Proc. SPIE 0775, Use Of Expert Systems In Photolithography, 0000 (17 April 1987); doi: 10.1117/12.940438
Proc. SPIE 0775, Sub-Micron Lithography Characterization Using An Expert System, 0000 (17 April 1987); doi: 10.1117/12.940439
Proc. SPIE 0775, An Analysis Procedure For Production Linewidth Data, 0000 (17 April 1987); doi: 10.1117/12.940440
Proc. SPIE 0775, Linewidth Control In Trilevel Etching, 0000 (17 April 1987); doi: 10.1117/12.940441
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