Emerging Patterning Technologies
Editor(s): Christopher Bencher
Proceedings Volume 10144 is from: Logo
26 February - 2 March 2017
San Jose, California, United States
Plenary Session
Proc. SPIE 10144, Materials innovation: It's no longer only about resolution, 0000 ();
Front Matter: Volume 10144
Proc. SPIE 10144, Front Matter: Volume 10144, 1014401 (26 April 2017);
Nanoprint Lithography for High-Volume Manufacturing
Proc. SPIE 10144, Nanoimprint system development for high-volume semiconductor manufacturing the and status of overlay performance, 1014405 (21 March 2017);
Proc. SPIE 10144, Study of nanoimprint lithography (NIL) for HVM of memory devices, 1014406 (21 March 2017);
Proc. SPIE 10144, Improved defectivity and particle control for nanoimprint lithography high-volume semiconductor manufacturing, 1014407 (21 March 2017);
Proc. SPIE 10144, High throughput nanoimprint lithography for semiconductor memory applications, 1014408 (21 March 2017);
Proc. SPIE 10144, Overlay control for nanoimprint lithography, 1014409 (3 April 2017);
Nanoprint Masks and Applications
Proc. SPIE 10144, Selective surface smoothening of 3D micro-optical elements, 101440B (21 March 2017);
Proc. SPIE 10144, New 3D structuring process for non-integrated circuit related technologies (Conference Presentation), 101440C ();
Proc. SPIE 10144, Development of nanoimprint lithography templates for the contact hole layer application (Conference Presentation), 101440D ();
DSA Integration
Proc. SPIE 10144, Overview and development of EDA tools for integration of DSA into patterning solutions, 101440E (21 March 2017);
Proc. SPIE 10144, Free energy modeling of block-copolymer within pillar confinements on DSA lithography, 101440F (21 March 2017);
Proc. SPIE 10144, Process, design rule, and layout co-optimization for DSA based patterning of sub-10nm Finfet devices, 101440G (21 March 2017);
Proc. SPIE 10144, Advanced fast 3D DSA model development and calibration for design technology co-optimization, 101440H (27 April 2017);
Direct-Write, Maskless Lithography
Proc. SPIE 10144, Progress on complementary patterning using plasmon-excited electron beamlets (Conference Presentation), 101440K ();
Proc. SPIE 10144, Simulation analysis of a miniaturized electron optics of the massively parallel electron-beam direct-write (MPEBDW) for multi-column system, 101440L (21 March 2017);
DSA Process and Integration: Joint Session with Conferences 10146 and 10144
Proc. SPIE 10144, Pattern defect reduction and LER improvement of chemo-epitaxy DSA process, 101440Q (21 March 2017);
DSA Materials and Processes: Joint Session with Conferences 10146 and 10144
Proc. SPIE 10144, Wide-range directed self-assembly lithography enabling wider range of applicable pattern size for both hexagonal multi-hole and line/space, 101440R (28 March 2017);
Poster Session
Proc. SPIE 10144, Rules-based correction strategies setup on sub-micrometer line and space patterns for 200mm wafer scale SmartNIL process within an integration process flow, 101440V (21 March 2017);
Proc. SPIE 10144, RLT uniformity improvement utilizing multi-scale NIL process simulation, 101440X (31 March 2017);
Proc. SPIE 10144, Latest evolution in a 300mm graphoepitaxy pilot line flow for L/S applications, 1014411 (21 March 2017);
Proc. SPIE 10144, The opportunity and challenge of spin coat based nanoimprint lithography, 1014412 (21 March 2017);
Proc. SPIE 10144, Inspection and fabrication of nano-imprint stamp using electron and ion dual beam system, 1014413 (21 March 2017);
Proc. SPIE 10144, Model-based guiding pattern synthesis for on-target and robust assembly of via and contact layers using DSA, 1014414 (21 March 2017);
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