PROCEEDINGS VOLUME 10145
SPIE ADVANCED LITHOGRAPHY | FEB 26 - MAR 2 2017
Metrology, Inspection, and Process Control for Microlithography XXXI
Proceedings Volume 10145 is from: Logo
SPIE ADVANCED LITHOGRAPHY
Feb 26 - Mar 2 2017
San Jose, California, United States
Front Matter: Volume 10145
Proc. SPIE 10145, Front Matter: Volume 10145, 1014501 (28 April 2017); doi: 10.1117/12.2279334
Keynote Session
Proc. SPIE 10145, Metrology challenges for in-line process control, 1014503 (21 April 2017); doi: 10.1117/12.2264717
Hybrid Metrology
Proc. SPIE 10145, Electrical test prediction using hybrid metrology and machine learning, 1014504 (12 April 2017); doi: 10.1117/12.2261091
Proc. SPIE 10145, Patterning control strategies for minimum edge placement error in logic devices, 1014505 (28 March 2017); doi: 10.1117/12.2260155
Proc. SPIE 10145, Hybrid scatterometry measurement for BEOL process control, 1014506 (28 March 2017); doi: 10.1117/12.2261452
Proc. SPIE 10145, The coming of age of the first hybrid metrology software platform dedicated to nanotechnologies (Conference Presentation), 1014507 (); doi: 10.1117/12.2258093
Proc. SPIE 10145, A hybrid solution using computational prediction and measured data to accurately determine process corrections with reduced overlay sampling, 1014508 (28 March 2017); doi: 10.1117/12.2257486
Overlay
Proc. SPIE 10145, Impact of stochastic process variations on overlay mark fidelity "towards the 5nm node", 1014509 (28 March 2017); doi: 10.1117/12.2258353
Proc. SPIE 10145, A complete methodology towards accuracy and lot-to-lot robustness in on-product overlay metrology using flexible wavelength selection, 101450A (28 March 2017); doi: 10.1117/12.2257662
Proc. SPIE 10145, Reaching for the true overlay in advanced nodes, 101450B (28 March 2017); doi: 10.1117/12.2260007
Proc. SPIE 10145, Image based overlay measurement improvements of 28nm FD-SOI CMOS front-end critical steps, 101450C (28 March 2017); doi: 10.1117/12.2257883
Proc. SPIE 10145, High-volume manufacturing device overlay process control, 101450D (28 March 2017); doi: 10.1117/12.2257836
Proc. SPIE 10145, In-depth analysis of indirect overlay method and applying in production environment, 101450E (28 March 2017); doi: 10.1117/12.2257963
Future
Proc. SPIE 10145, Metrology capabilities and needs for 7nm and 5nm logic nodes, 101450G (28 March 2017); doi: 10.1117/12.2260870
Proc. SPIE 10145, Variability study with CD-SEM metrology for STT-MRAM: correlation analysis between physical dimensions and electrical property of the memory element, 101450H (28 March 2017); doi: 10.1117/12.2257908
Proc. SPIE 10145, Designed tools for analysis of lithography patterns and nanostructures, 101450I (28 March 2017); doi: 10.1117/12.2258612
Proc. SPIE 10145, Required metrology and inspection for nanoimprint lithography, 101450J (28 March 2017); doi: 10.1117/12.2258369
Proc. SPIE 10145, High-throughput electrical characterization for robust overlay lithography control, 101450K (28 March 2017); doi: 10.1117/12.2260707
Proc. SPIE 10145, Sub-wavelength transmission and reflection mode tabletop imaging with 13nm illumination via ptychography CDI, 101450L (28 March 2017); doi: 10.1117/12.2271386
EUV Mask Inspection and Imaging: Joint Session with Conferences 10143 and 10145
Proc. SPIE 10145, Application of actinic mask review system for the preparation of HVM EUV lithography with defect free mask, 101450M (28 March 2017); doi: 10.1117/12.2257390
Proc. SPIE 10145, Towards a stand-alone high-throughput EUV actinic photomask inspection tool: RESCAN, 101450N (28 March 2017); doi: 10.1117/12.2258379
Wafer-Shape Induced Overlay
Proc. SPIE 10145, Patterned wafer geometry grouping for improved overlay control, 101450O (28 March 2017); doi: 10.1117/12.2257834
Proc. SPIE 10145, Wafer-shape metrics based foundry lithography, 101450P (28 March 2017); doi: 10.1117/12.2257799
Proc. SPIE 10145, Topography based wafer clustering for wafer level overlay correction, 101450Q (28 March 2017); doi: 10.1117/12.2259858
Process Control
Proc. SPIE 10145, In-line E-beam metrology and defect inspection: industry reflections, hybrid E-beam opportunities, recommendations and predictions, 101450R (28 March 2017); doi: 10.1117/12.2261524
Proc. SPIE 10145, Smart sampling for process control, 101450S (28 March 2017); doi: 10.1117/12.2258031
Proc. SPIE 10145, A new method for wafer quality monitoring using semiconductor process big data, 101450T (28 March 2017); doi: 10.1117/12.2256435
Proc. SPIE 10145, Combined process window monitoring for critical features, 101450U (28 March 2017); doi: 10.1117/12.2259910
Proc. SPIE 10145, Computational overlay metrology with adaptive data analytics, 101450V (28 March 2017); doi: 10.1117/12.2258039
Proc. SPIE 10145, Surface topography analysis and performance on post-CMP images (Conference Presentation), 101450W (); doi: 10.1117/12.2258357
Proc. SPIE 10145, Advanced in-production hotspot prediction and monitoring with micro-topography, 101450X (28 March 2017); doi: 10.1117/12.2260024
Line Edge Roughness (LER)
Proc. SPIE 10145, Global minimization line-edge roughness analysis of top down SEM images, 101450Y (28 March 2017); doi: 10.1117/12.2258035
Proc. SPIE 10145, Level crossing methodology applied to line-edge roughness characterization, 101450Z (28 March 2017); doi: 10.1117/12.2258602
Proc. SPIE 10145, Multitaper and multisegment spectral estimation of line-edge roughness, 1014510 (28 March 2017); doi: 10.1117/12.2258053
Proc. SPIE 10145, An OCD perspective of line edge and line width roughness metrology, 1014511 (28 March 2017); doi: 10.1117/12.2258196
SEM I
Proc. SPIE 10145, Framework for SEM contour analysis, 1014513 (28 March 2017); doi: 10.1117/12.2258059
Proc. SPIE 10145, Robust 2D patterns process variability assessment using CD-SEM contour extraction offline metrology, 1014514 (28 March 2017); doi: 10.1117/12.2257876
Proc. SPIE 10145, CD-SEM distortion quantification for EPE metrology and contour analysis, 1014515 (28 March 2017); doi: 10.1117/12.2260664
Inspection and Reference Metrology
Proc. SPIE 10145, Assessing the wavelength extensibility of optical patterned defect inspection, 1014516 (30 March 2017); doi: 10.1117/12.2262191
Proc. SPIE 10145, Anamorphic approach for developing hi-efficiency illumination system to inspect defects on semiconductor wafers, 1014517 (28 March 2017); doi: 10.1117/12.2258162
Proc. SPIE 10145, 1.5nm fabrication of test patterns for characterization of metrological systems, 1014518 (28 March 2017); doi: 10.1117/12.2257624
Proc. SPIE 10145, Fabrication of metrology test structures with helium ion beam direct write, 1014519 (28 March 2017); doi: 10.1117/12.2257989
Proc. SPIE 10145, 3D-profile measurement of advanced semiconductor features by using FIB as reference metrology, 101451A (19 April 2017); doi: 10.1117/12.2257217
Optical Metrology
Proc. SPIE 10145, High-NA optical CD metrology on small in-cell targets enabling improved higher order dose control and process control for logic, 101451B (28 March 2017); doi: 10.1117/12.2260268
Proc. SPIE 10145, Complex metrology on 3D structures using multi-channel OCD, 101451C (28 March 2017); doi: 10.1117/12.2261419
Proc. SPIE 10145, Optical metrology strategies for inline 7nm CMOS logic product control, 101451D (28 March 2017); doi: 10.1117/12.2260491
Proc. SPIE 10145, Evaluating the effects of modeling errors for isolated finite 3D targets, 101451E (30 March 2017); doi: 10.1117/12.2262544
Proc. SPIE 10145, Scatterometry control for multiple electron beam lithography, 101451F (28 March 2017); doi: 10.1117/12.2261389
Proc. SPIE 10145, Advanced optical modeling of TiN metal hard mask for scatterometric critical dimension metrology, 101451G (28 March 2017); doi: 10.1117/12.2258659
Proc. SPIE 10145, Advanced applications of scatterometry based optical metrology, 101451H (28 March 2017); doi: 10.1117/12.2261430
3D SEM and 3D Applications
Proc. SPIE 10145, SEM image prediction based on modeling of electron-solid interaction, 101451I (28 March 2017); doi: 10.1117/12.2257661
Proc. SPIE 10145, SEM-based overlay measurement between via patterns and buried M1 patterns using high-voltage SEM, 101451J (28 March 2017); doi: 10.1117/12.2257848
Proc. SPIE 10145, High-precision CD measurement using energy-filtering SEM techniques, 101451K (28 March 2017); doi: 10.1117/12.2257205