PROCEEDINGS VOLUME 1087
1989 SANTA CLARA SYMPOSIUM ON MICROLITHOGRAPHY | FEB 27 - MAR 3 1989
Integrated Circuit Metrology, Inspection, and Process Control III
IN THIS VOLUME

0 Sessions, 55 Papers, 0 Presentations
All Papers  (55)
1989 SANTA CLARA SYMPOSIUM ON MICROLITHOGRAPHY
Feb 27 - Mar 3 1989
San Jose, CA, United States
All Papers
Proc. SPIE 1087, Electron Beam Metrology For Integrated Circuit Structures: Predictions And Experiments, 0000 (19 July 1989); doi: 10.1117/12.953073
Proc. SPIE 1087, A Study of Electron Damage Effects During Low Voltage SEM Metrology, 0000 (19 July 1989); doi: 10.1117/12.953074
Proc. SPIE 1087, Techniques For High Speed SEM Wafer Inspection For Production Applications, 0000 (19 July 1989); doi: 10.1117/12.953075
Proc. SPIE 1087, Electron Beam Generation Based On Negative Electron Affinity Photocathodes, 0000 (19 July 1989); doi: 10.1117/12.953076
Proc. SPIE 1087, Metrological Electron Microscope for the Certification of Magnification and Linewidth Artifacts for the Semiconductor Industry, 0000 (19 July 1989); doi: 10.1117/12.953077
Proc. SPIE 1087, Scanning Electron Microscope Magnification Calibration for Metrology Applications, 0000 (19 July 1989); doi: 10.1117/12.953078
Proc. SPIE 1087, Accuracy of Spatial Metrology, 0000 (19 July 1989); doi: 10.1117/12.953079
Proc. SPIE 1087, Contact Window Metrology Using The Photocleave Technique, 0000 (19 July 1989); doi: 10.1117/12.953080
Proc. SPIE 1087, Proximity- and Astigmatism-Tolerant Testsites For Electrical Linewidth Measurement, 0000 (19 July 1989); doi: 10.1117/12.953081
Proc. SPIE 1087, Electrical Defect Monitoring For Process Control, 0000 (19 July 1989); doi: 10.1117/12.953082
Proc. SPIE 1087, An Analysis Of Electron Beam Registration Capabilities By Electrical Measurement Methods, 0000 (19 July 1989); doi: 10.1117/12.953083
Proc. SPIE 1087, Application of submicron Linewidth Measuring Technique To Photomasks, 0000 (19 July 1989); doi: 10.1117/12.953084
Proc. SPIE 1087, Effect Of Resist Side-Wall Slope Variations On Confocal Optical Metrology, 0000 (19 July 1989); doi: 10.1117/12.953085
Proc. SPIE 1087, The Application Of Coherence Probe Microscopy For Submicron Critical Dimension Linewidth Measurement, 0000 (19 July 1989); doi: 10.1117/12.953086
Proc. SPIE 1087, Characterization of a Real-time Confocal Scanning Optical Microscope, 0000 (19 July 1989); doi: 10.1117/12.953087
Proc. SPIE 1087, Linewidth Edge Detection Algorithm for Coherent Image Profiles, 0000 (19 July 1989); doi: 10.1117/12.953088
Proc. SPIE 1087, Statistical Correlation Between Optical Linewidth Measurement Systems With Variance Components Analysis, 0000 (19 July 1989); doi: 10.1117/12.953089
Proc. SPIE 1087, Automated Calibration Of Optical Photomask Linewidth Standards At The National Institute Of Standards And Technology, 0000 (19 July 1989); doi: 10.1117/12.953090
Proc. SPIE 1087, Characterization of Automated Wafer Inspection Tools, 0000 (19 July 1989); doi: 10.1117/12.953091
Proc. SPIE 1087, Combining Electrical Defect Monitors with Automatic Visual Inspection Systems, 0000 (19 July 1989); doi: 10.1117/12.953092
Proc. SPIE 1087, The P300: An Approach to Automated Inspection of Patterned Wafers, 0000 (19 July 1989); doi: 10.1117/12.953093
Proc. SPIE 1087, Defect Partitioning: A New Methodology, 0000 (19 July 1989); doi: 10.1117/12.953094
Proc. SPIE 1087, Matching Management Of Multiple Wafer Steppers Using A Stable Standard And A Matching Simulator, 0000 (19 July 1989); doi: 10.1117/12.953095
Proc. SPIE 1087, Lens Matching And Distortion Testing In A Multi-Stepper, Sub-Micron Environment, 0000 (19 July 1989); doi: 10.1117/12.953096
Proc. SPIE 1087, Data Regression Procedure For Comparative Evaluation Of Photolithography Systems, 0000 (19 July 1989); doi: 10.1117/12.953097
Proc. SPIE 1087, A Computer Aided Engineering Workstation For Registration Control, 0000 (19 July 1989); doi: 10.1117/12.953098
Proc. SPIE 1087, Advanced Manufacturing Techniques As Applied To ASIC Photolithographic Processing, 0000 (19 July 1989); doi: 10.1117/12.953099
Proc. SPIE 1087, A Systematic Approach for I-line Manufacturing Process Optimization, 0000 (19 July 1989); doi: 10.1117/12.953100
Proc. SPIE 1087, Process Sensitivity Analysis: Application to Photolithography, 0000 (19 July 1989); doi: 10.1117/12.953101
Proc. SPIE 1087, Resist Profile Control Obtained Through A Desirability Function And Statistically Designed Experiments, 0000 (19 July 1989); doi: 10.1117/12.953102
Proc. SPIE 1087, Development Process Control And Optimization Utilizing An End Point Monitor, 0000 (19 July 1989); doi: 10.1117/12.953103
Proc. SPIE 1087, Endpoint Detection Of Photoresist Development Using Multiple Wavelengths And Polarized Light, 0000 (19 July 1989); doi: 10.1117/12.953104
Proc. SPIE 1087, A Model for End Point Detect During the Development of Photoresists, 0000 (19 July 1989); doi: 10.1117/12.953105
Proc. SPIE 1087, Scanning Photon And Scanning Electron Metrology On Photomasks, 0000 (19 July 1989); doi: 10.1117/12.953106
Proc. SPIE 1087, Sub 0.5 Micron Optical Metrology, 0000 (19 July 1989); doi: 10.1117/12.953107
Proc. SPIE 1087, Optical Phase-Shifting Technique For Submicron Linewidth Measurement: Simulations And Measurements, 0000 (19 July 1989); doi: 10.1117/12.953108
Proc. SPIE 1087, Optical Overlay Versus Electric Probe Measurement, 0000 (19 July 1989); doi: 10.1117/12.953109
Proc. SPIE 1087, A Statistical Approach To Automated Overlay Measurement Precision, Repeatability, And Reproducibility, 0000 (19 July 1989); doi: 10.1117/12.953110
Proc. SPIE 1087, Statistically Comparing Three Optical Cd Measurement Systems, 0000 (19 July 1989); doi: 10.1117/12.953111
Proc. SPIE 1087, Investigation Of Linewidth Uniformity In X-Ray Lithography, 0000 (19 July 1989); doi: 10.1117/12.953112
Proc. SPIE 1087, Applications of STM Technologies, 0000 (19 July 1989); doi: 10.1117/12.953113
Proc. SPIE 1087, Flatness Measurements Of Mounted Stage Mirrors, 0000 (19 July 1989); doi: 10.1117/12.953114
Proc. SPIE 1087, Displacement Interferometer with High Resolution and Low Sensitivity to Temperature, 0000 (19 July 1989); doi: 10.1117/12.953115
Proc. SPIE 1087, Optical Measurement Of Contacts, 0000 (19 July 1989); doi: 10.1117/12.953116
Proc. SPIE 1087, Recent Advances In Automated Patterned Wafer Inspection, 0000 (19 July 1989); doi: 10.1117/12.953117
Proc. SPIE 1087, Optical Thick And Thin Film Metrology On Various Substrates Using A High Resolution Reflection Spectrophotometer, 0000 (19 July 1989); doi: 10.1117/12.953118
Proc. SPIE 1087, An In Situ Interferometric Analysis Of Resist Development On Photomask Substrates, 0000 (19 July 1989); doi: 10.1117/12.953119
Proc. SPIE 1087, Nonparametric Approximation Methods-A New Tool For Process Engineering, 0000 (19 July 1989); doi: 10.1117/12.953120
Proc. SPIE 1087, Synergistic Effects Of Softbake And Hardbake On Thermal Softening Using Statistically Designed Experiments, 0000 (19 July 1989); doi: 10.1117/12.953121
Proc. SPIE 1087, Method For Accurately Forecasting The Effects Of The "Post Exposure Bake", 0000 (19 July 1989); doi: 10.1117/12.953122
Proc. SPIE 1087, Resist On Quartz Inspection In A Manufacturing Environment, 0000 (19 July 1989); doi: 10.1117/12.953123
Proc. SPIE 1087, Methodology For Reduction Of Sampling On The Visual Inspection Of Developed And Etched Wafers, 0000 (19 July 1989); doi: 10.1117/12.953124
Proc. SPIE 1087, New Logic State Measurement Technique For The Electron Beam Tester, 0000 (19 July 1989); doi: 10.1117/12.953125
Proc. SPIE 1087, A Machine Vision Architecture For Integrated Circuit Inspection, 0000 (19 July 1989); doi: 10.1117/12.953126
Proc. SPIE 1087, Wafer Inspection Technology For Submicron Devices, 0000 (19 July 1989); doi: 10.1117/12.953127
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