PROCEEDINGS VOLUME 1185
1989 MICROELECTRONIC INTEGRATED PROCESSING CONFERENCES | 10-13 OCTOBER 1989
Dry Processing for Submicrometer Lithography
IN THIS VOLUME

0 Sessions, 28 Papers, 0 Presentations
All Papers  (28)
1989 MICROELECTRONIC INTEGRATED PROCESSING CONFERENCES
10-13 October 1989
Santa Clara, United States
All Papers
Proc. SPIE 1185, Silylated Acid Hardened Resist [SAHR] Technology: Positive, Dry Developable Deep UV Resists, 0000 (30 January 1990); doi: 10.1117/12.978041
Proc. SPIE 1185, Application of the Kinetic Theory of Bombardment Induced Interface Evolution to the Pattern Transfer Step in Multi-Layer Lithography, 0000 (30 January 1990); doi: 10.1117/12.978042
Proc. SPIE 1185, Etch Resistance of Silicon Containing Polymers In Oxygen Plasma Chemistry, 0000 (30 January 1990); doi: 10.1117/12.978043
Proc. SPIE 1185, Submicron Single-Layer Lithography Using Reactive Ion Etching, 0000 (30 January 1990); doi: 10.1117/12.978044
Proc. SPIE 1185, Dry Process Pattern Transfer for X-Ray Mask Fabrication, 0000 (30 January 1990); doi: 10.1117/12.978045
Proc. SPIE 1185, Magnetron-Enhanced Etching Of Photoresist For Sub-Micron Patterning, 0000 (30 January 1990); doi: 10.1117/12.978046
Proc. SPIE 1185, Entrenched Metal Liftoff Using A Novel Bilayer Process, 0000 (30 January 1990); doi: 10.1117/12.978047
Proc. SPIE 1185, Dry Etching Of Niobium Oxyde Thin Films, 0000 (30 January 1990); doi: 10.1117/12.978048
Proc. SPIE 1185, In-situ Particulate Contamination Studies In Process Plasmas, 0000 (30 January 1990); doi: 10.1117/12.978049
Proc. SPIE 1185, Plasma Assisted Deposition and Device Technology: Interlevel Dielectric Considerations, 0000 (30 January 1990); doi: 10.1117/12.978050
Proc. SPIE 1185, High Rate And Selective Reactive Ion Etching Of Polysilicon, 0000 (30 January 1990); doi: 10.1117/12.978051
Proc. SPIE 1185, Profile Control And Stringer Removal During Plasma Etch Of Submicrometer Polysilicon Lines, 0000 (30 January 1990); doi: 10.1117/12.978052
Proc. SPIE 1185, Advanced 200 nm Gate Profile Fabrication With Reactive Ion Etching, 0000 (30 January 1990); doi: 10.1117/12.978053
Proc. SPIE 1185, CMOS DRAM Alpha-Particle Effects, 0000 (30 January 1990); doi: 10.1117/12.978054
Proc. SPIE 1185, Electron Cyclotron Resonance CVD Planarization and Trench-Fill Processes, 0000 (30 January 1990); doi: 10.1117/12.978055
Proc. SPIE 1185, Characterization Of Sidewall Passivation Material Deposited During Trench Etch, 0000 (30 January 1990); doi: 10.1117/12.978056
Proc. SPIE 1185, Spatial And Size Distributions Of Submicron Particles In rf Plasmas, 0000 (30 January 1990); doi: 10.1117/12.978057
Proc. SPIE 1185, A Comparison Of The Optical Projection Lithography Simulators In Sample And Prolith, 0000 (30 January 1990); doi: 10.1117/12.978058
Proc. SPIE 1185, Statistical Methodology For The Evaluation, Characterization And Optimization Of Dry Etch Modules, 0000 (30 January 1990); doi: 10.1117/12.978059
Proc. SPIE 1185, Continuum Modeling Of rf Glow Discharges, 0000 (30 January 1990); doi: 10.1117/12.978060
Proc. SPIE 1185, Optimization Of A Highly Selective Nitride/Oxide Rie In A Batch Etching Machine By Statistical Analysis, 0000 (30 January 1990); doi: 10.1117/12.978061
Proc. SPIE 1185, A Profile Evolution Model With Redeposition, 0000 (30 January 1990); doi: 10.1117/12.978062
Proc. SPIE 1185, In situ Wafer Monitoring For Plasma Etching, 0000 (30 January 1990); doi: 10.1117/12.978063
Proc. SPIE 1185, Radical and Molecular Product Concentration Measurements in CF4 RF Plasmas by Infrared Tunable Diode Laser Absorption RF plasmas by infrared tunable diode laser absorption, 0000 (30 January 1990); doi: 10.1117/12.978064
Proc. SPIE 1185, A Review of Magnetron Etch Technology, 0000 (30 January 1990); doi: 10.1117/12.978065
Proc. SPIE 1185, Magneto-Transport Characterization Of E-Beam-Induced Damage In GaAs-AlGaAs Heterostructures, 0000 (30 January 1990); doi: 10.1117/12.978066
Proc. SPIE 1185, Damage To Gate Oxides In Reactive Ion Etching, 0000 (30 January 1990); doi: 10.1117/12.978067
Proc. SPIE 1185, Application Of Plasma Diagnostic Techniques To Dry Etching Process Control, 0000 (30 January 1990); doi: 10.1117/12.978068
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