PROCEEDINGS VOLUME 1389
ADVANCES IN INTELLIGENT ROBOTICS SYSTEMS | 4-9 NOVEMBER 1990
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
IN THIS VOLUME

0 Sessions, 54 Papers, 0 Presentations
ADVANCES IN INTELLIGENT ROBOTICS SYSTEMS
4-9 November 1990
Boston, MA, United States
Electrical Technologies
Proc. SPIE 1389, Effects of packaging and interconnect technology on testability of printed wiring boards, 0000 (1 April 1991); doi: 10.1117/12.25512
Proc. SPIE 1389, Interconnection problems in VLSI random access memory chip, 0000 (1 April 1991); doi: 10.1117/12.25513
Proc. SPIE 1389, Design and process impact on thin-film interconnection performance, 0000 (1 April 1991); doi: 10.1117/12.25514
Proc. SPIE 1389, Design, simulation model, and measurements for high-density interconnections, 0000 (1 April 1991); doi: 10.1117/12.25515
Proc. SPIE 1389, V-line: a new interconnect for packaging and microwave applications, 0000 (1 April 1991); doi: 10.1117/12.25516
Proc. SPIE 1389, Multidisciplinary analysis and design of printed wiring boards, 0000 (1 April 1991); doi: 10.1117/12.25517
Proc. SPIE 1389, Termination for minimal reflection of high-speed pulse propagation along multiple-coupled microstrip lines, 0000 (1 April 1991); doi: 10.1117/12.25518
Proc. SPIE 1389, Electrical characteristics of lossy interconnections for high-performance computer applications, 0000 (1 April 1991); doi: 10.1117/12.25520
Proc. SPIE 1389, Switching noise in a medium-film copper/polyimide multichip module, 0000 (1 April 1991); doi: 10.1117/12.25521
Proc. SPIE 1389, Sensitivity study of printed wiring board plated-through-holes copper barrel voids, 0000 (1 April 1991); doi: 10.1117/12.25522
Proc. SPIE 1389, Distortion characteristic of transient signals through bend discontinuity of high-speed integrated curcuits, 0000 (1 April 1991); doi: 10.1117/12.25523
Proc. SPIE 1389, Measurements and characterization of multiple-coupled interconnection lines in hybrid and monolithic integrated circuits, 0000 (1 April 1991); doi: 10.1117/12.25524
Proc. SPIE 1389, Novel microstructures for low-distortion chip-to-chip interconnects, 0000 (1 April 1991); doi: 10.1117/12.25525
Proc. SPIE 1389, Characterization, modeling, and design of dielectric resonators based on thin ceramic tape, 0000 (1 April 1991); doi: 10.1117/12.25526
Proc. SPIE 1389, Application of electrodeposition processes to advanced package fabrication, 0000 (1 April 1991); doi: 10.1117/12.25527
Proc. SPIE 1389, Frequency domain evaluation of the accuracy of lumped element models for RLC transmission lines, 0000 (1 April 1991); doi: 10.1117/12.25528
Proc. SPIE 1389, Analysis and modeling of uniformly- and nonuniformly-coupled lossy lines for interconnections and packaging in hybrid and monolithic circuits, 0000 (1 April 1991); doi: 10.1117/12.25529
Proc. SPIE 1389, Effects of conductor losses on cross-talk in multilevel-coupled VLSI interconnections, 0000 (1 April 1991); doi: 10.1117/12.25530
Proc. SPIE 1389, Dispersion of picosecond pulses propagating on microstrip interconnections on semiconductor integrated-circuit substrates, 0000 (1 April 1991); doi: 10.1117/12.25531
Proc. SPIE 1389, Efficient and accurate dynamic analysis of microstrip integrated circuits, 0000 (1 April 1991); doi: 10.1117/12.25532
Proc. SPIE 1389, Electrical characterization of the interconnects inside a computer, 0000 (1 April 1991); doi: 10.1117/12.25534
Proc. SPIE 1389, Transmission of high-speed voltage waves at the junction of three transmission lines, 0000 (1 April 1991); doi: 10.1117/12.25535
Proc. SPIE 1389, Analysis of skin effect loss in high-frequency interconnects with finite metallization thickness, 0000 (1 April 1991); doi: 10.1117/12.25536
Proc. SPIE 1389, Three-dimensional capacitance modeling of advanced multilayer interconnection technologies, 0000 (1 April 1991); doi: 10.1117/12.25537
Optical Technologies
Proc. SPIE 1389, Overview of optical interconnect technology, 0000 (1 April 1991); doi: 10.1117/12.25538
Proc. SPIE 1389, Optical interconnects for parallel processing, 0000 (1 April 1991); doi: 10.1117/12.25539
Proc. SPIE 1389, Potential roles of optical interconnections within broadband switching modules, 0000 (1 April 1991); doi: 10.1117/12.25540
Proc. SPIE 1389, Vertical cavity lasers for optical interconnects, 0000 (1 April 1991); doi: 10.1117/12.25542
Proc. SPIE 1389, Vertical 3-D integration of silicon waveguides in a Si-SiO2-Si-SiO2-Si structure, 0000 (1 April 1991); doi: 10.1117/12.25543
Proc. SPIE 1389, Asymmetric Fabry-Perot modulators for optical signal processing and optical computing applications, 0000 (1 April 1991); doi: 10.1117/12.25544
Proc. SPIE 1389, Compact PIN-amplifier module for giga bit rates optical interconnection, 0000 (1 April 1991); doi: 10.1117/12.25545
Proc. SPIE 1389, Time-division optical microarea networks, 0000 (1 April 1991); doi: 10.1117/12.25546
Proc. SPIE 1389, High-speed optical interconnects for parallel processing and neural networks, 0000 (1 April 1991); doi: 10.1117/12.25547
Proc. SPIE 1389, Quantum-well devices for optics in digital systems, 0000 (1 April 1991); doi: 10.1117/12.47719
Proc. SPIE 1389, Free-space optical interconnect using microlasers and modulator arrays, 0000 (1 April 1991); doi: 10.1117/12.25549
Proc. SPIE 1389, Multiprocessor optical bus, 0000 (1 April 1991); doi: 10.1117/12.25550
Proc. SPIE 1389, Integrated packaging of optical backplanes, 0000 (1 April 1991); doi: 10.1117/12.25551
Proc. SPIE 1389, Computer-generated holograms fabricated on photopolymer for optical interconnect applications, 0000 (1 April 1991); doi: 10.1117/12.25552
Proc. SPIE 1389, High-density waveguide modulator arrays for parallel interconnection, 0000 (1 April 1991); doi: 10.1117/12.25554
Proc. SPIE 1389, Electro-optic polymer devices for optical interconnects, 0000 (1 April 1991); doi: 10.1117/12.25555
Proc. SPIE 1389, Waveguiding characteristics in polyimide films with different chemistry of formation, 0000 (1 April 1991); doi: 10.1117/12.25556
Proc. SPIE 1389, Proposed electro-optic package with bidirectional lensed coupling, 0000 (1 April 1991); doi: 10.1117/12.25557
Proc. SPIE 1389, Comparison of optical and electronic 3-dimensional circuits, 0000 (1 April 1991); doi: 10.1117/12.25558
Proc. SPIE 1389, Intercircuit optical interconnects using quantum-well modulators, 0000 (1 April 1991); doi: 10.1117/12.25560
Proc. SPIE 1389, Holographic optical backplane for boards interconnection, 0000 (1 April 1991); doi: 10.1117/12.25561
Proc. SPIE 1389, Methylene-blue-sensitized gelatin used for the fabrication of holographic optical elements in the near-infrared, 0000 (1 April 1991); doi: 10.1117/12.25562
Proc. SPIE 1389, Propagating beam method simulation of planar multimode optical waveguides, 0000 (1 April 1991); doi: 10.1117/12.25563
Proc. SPIE 1389, Analysis of alignment in optical interconnection systems, 0000 (1 April 1991); doi: 10.1117/12.25564
Proc. SPIE 1389, Integrated compact matrix-vector multipliers for optical interconnect applications, 0000 (1 April 1991); doi: 10.1117/12.25565
Proc. SPIE 1389, Interconnection requirements in avionic systems, 0000 (1 April 1991); doi: 10.1117/12.25566
Proc. SPIE 1389, Optical receivers in ECL for 1GHz parallel links, 0000 (1 April 1991); doi: 10.1117/12.25568
Proc. SPIE 1389, Holographic optical elements for free-space clock distribution, 0000 (1 April 1991); doi: 10.1117/12.25569
Electrical Technologies
Proc. SPIE 1389, Silicon-on-silicon microsystem in plastic packages, 0000 (1 April 1991); doi: 10.1117/12.47720
Optical Technologies
Proc. SPIE 1389, Two Gbit/s photonic backplane for telephone cards interconnection, 0000 (1 April 1991); doi: 10.1117/12.47721
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